These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.

Adapters on these pages are listed in ascending order by the number of pins   

Part Number		Description	Price	Shopping Cart
BB28MLF20-D6-SMT-S		For analog devices in 28-MLF, 28QFN, package has 600-mil DIP plug for plugging into a DDP socket or solderless breadboard and rows of holes for discrete components and test pins. QFN Type 1 package support Packages up to 56 Pads 0.5mm Pitch Size 1.3 x 1.4 inches Hole diameter 21 mils	$21.00
BBA-56TS1-36-1		For SMT devices in TSOP Type 1 package up to 56 pads. Additional via holes for additional components, wire wrap or test pins. TSOP Type 1 package support Packages up to 56 Pads 0.5mm Pitch 8.0mm, 14.0mm, 20.0mm tip-to-tip components compatible Size 1.2 x 1.5 inches Hole diameter 36 mils	$10.00
BBA-QFN-QFP-36-Atmel-1		For QFN QFP TQFP breadboarding, prototyping, adapter for QFN QFP TQFP ATMEL microcontrollers. One side of the adapter has pads on 0.5mm pitch for 32, 40, 48, 56, 64, 72, 80, QFN QFP TQFP AVR and 80C51 architecture microcontrollers. The other side has 0.8mm spaced pads for 32 QFP, 44 QFP, 44 TQFP, and 64 TQFP microcontrollers. The pads are surrounded by two rows of 36-mil holes for wire-wrap pins, components, or wires. QFN QFP TQFP Packages Packages up to 56 Pads 0.5mm Pitch on top with 32, 40, 48, 56, 64, 72, 80 QFN QFP TQFP AVR and 80C51 architecture microcontroller pads 0.8mm Pitch on bottom with 32 QFP, 44 QFP, 44 TQFP, and 64 TQFP microcontroller pads Size 1.3 x 1.3 inches Hole diameter 36 mils	$9.00
BBA-QFN-QFP-36-Microchip-1		For PIC microcontroleers from Microchip Technology. QFN QFP TQFP breadboarding, One side of the adapter has pads on 0.5mm pitch for 32, 40, 48, 56, 64, 72, 80, QFN QFP TQFP. The other side has 0.65 mm spaced pads for PIC 28 QFN & 44 QFN packages plus pads for PIC 44 TQFP & TQFP 0.8mm pitch, & PIC 100 pad at 0.05mm pitch. QFN QFP TQFP Packages PIC 0.5mm pitch for 32, 40, 48, 56, 64, 72, 80, QFN QFP TQFP microcontroller pads PIC 0.65mm pitch for 28, 44 QFN microcontroller pads PIC 0.5mm pitch for 100 TQFP microcontroller pads Size 1.6 x 1.6 inches Hole diameter 36 mils	$12.00
MBB-SOIC-SSOP-36-1		SOIC-SSOP mini breadboard has pads on 20 mils for SOIC components on one side and pads on 0.65mm pitch for SSOP components on the other side. Hole associated with each SOIC or SSOP pad, plus mini breadboard with five rows of holes on either side of the SOIC and SSOP pads. Those holes accept 300-mil wide DIP packages, wire-wrap pins or components. SOIC SSOP Packages 0.65mm pitch pads Size 2.3 x 2.3 inches Hole diameter 36 mils	$15.00
MCBB4X5-20-36-1		Microcontroller breadboard has pads for most of the SMT packages required for breadbording a microcontroller system. There are pads for QFN, QFP, TQFP, SOIC, SSOP, SOT23 and SC70 packages and holes for one D9 connector. QFN, QFP, TQFP pads on 0.5mm pitch accept QFN, QFP, TQFP packages with 12, 16, 20, 24, 28, 32, 36, 40, 44, 48, 52, 56, 60, 64, 68, 72, 76, 80 and 84 leads or contacts. SOIC pads, on 50-mils pitch, accept SOIC packages of any width up to 56 leads or a combination of several smaller SOIC packages. SSOP pads, on 0.65mm pitch, accept 36-lead SSOP packages with any body width or a combination of smaller SSOP packages. Also available are pads for two SOT23-6 and two SC70 packages. Every hole has next to it power and ground lines. Hole size is 36 mils for wire-wrap pins.	$35.00

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