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QFN MLF Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.


Adapters on these pages are listed in ascending order by the number of pins   

10 Pads 16 Pads 20 Pads 24 Pads 28 Pads 32 Pads 38 Pads 40 Pads 44 Pads 48 Pads 56 Pads 64 Pads


Part Number   Multiple IC Pads    Price Shopping Cart
BBA-QFN-32-80 Multiple QFN chip pads to breadboard adapter. Supports 32, 40, 48, 56, 64, 72, or 80 QFN pads at 0.5mm (20 mils) Pitch, from 5.0mm to 14.0mm Tip to tip.
  • 2.54 mm, (0.10 inch) Breadboard hole pattern
  • 0.5mm (20 mils) Pitch for 32, 40, 48, 56, 64, 72, 80, QFN SMT pads
  • 5.0mm to 14mm Tip to tip
  • Size 1.6 x 1.6 inches
$35.00

Part Number   10 Pad    Price Shopping Cart
10QFN20-D6-SMT-S 10 pad QFN SMT to DIP breadboard adapter converts SMT package with pitch of 0.5mm to two 600 mil DIP pin rows.
  • QFN Package type
  • 10Pins
  • 0.5mm (20 mils) Pitch device
  • 2.54mm (100 mil) Package
  • DIP rows are 600 mills apart
$8.00

Part Number   16 Pad    Price Shopping Cart
16QFN20-D3-SMT-S 16 pad QFN SMT to DIP breadboard adapter converts SMT package with pitch of 0.5mm to two 300-mil DIP pin rows.
  • QFN Package type
  • 16 Pins
  • 0.5mm (20 mils) Pitch device
  • 4.0mm Package
  • DIP rows are 300 mills apart
$8.00
16QFN26-D3-SMT-S 16 pad QFN MLF SMT to DIP breadboard adapter converts SMT package with pitch of 0.65mm to two 300-mil DIP pin rows.
Microprocessors: PIC16F610, PIC16HV610, PIC16F616, PIC16HV616, PIC16F684, PIC16F688
  • QFN Package type
  • 16 Pins
  • 0.65mm Pitchdevice
  • 4.0mm Package
  • DIP rows are 300 mills apart
$8.00
16QFN39-D6-SMT-S 16 pad QFN MLF SMT to DIP breadboard adapter converts SMT package with pitch of 1.0 mm to two 600 mil DIP pin rows.
  • QFN Package type
  • 16 Pins
  • 1.0 mm Pitch (39 mil)device
  • 6.0mm Package
  • DIP rows are 600 mills apart
$8.00

Part Number   20 Pad    Price Shopping Cart
20QFN20L-D3-SMT-S 20 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 300-mil apart DIP pins. Center pin of the QFN on the side which faces pins 1 and 20 on the DIP is connected to pin 1 on the DIP.
  • QFN Package type
  • 20 Pins
  • 0.5mm (20 mils) Pitch device
  • 4.0mm Package
  • DIP rows are 300 mills apart
$10.00
20QFN20R-D3-SMT-S 20 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 300-mil apart DIP pins. Center pin of the QFN on the side which faces pins 1 and 20 on the DIP is connected to pin 20 on the DIP.
  • QFN Package type
  • 20 Pins
  • 0.5mm (20 mils) Pitch device
  • 4.0mm Package
  • DIP rows are 300 mills apart
$10.00
20QFN26-D6-SMT 20 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600 mils apart DIP pins.
  • QFN Package type
  • 20 Pins
  • 0.65mm (26 mils) Pitch device
  • 6.9.0mm (0.27 inch) maximum package
  • DIP rows are 600 mills apart
$10.00

Part Number   24 Pad    Price Shopping Cart
24QFN16-D6-SMT-S 24 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 24 Pins
  • 0.4mm Pitch device
  • 2.25mm Package
  • DIP rows are 600 mills apart
$12.00
24QFN20-D6-SMT-S 24 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 24 Pins
  • 0.5mm (20 mils) Pitch device
  • 4.0mm Package
  • DIP rows are 600 mills apart
$12.00

Part Number   28 Pad    Price Shopping Cart
BB28MLF20-D6-SMT-S   For SMT devices in 28-MLF, 28QFN package to 600-mil DIP plug. Additional via holes for additional components, wire wrap, or test pins.
  • Top pattern for 28 MLF & QFN
  • Bottom Dual DIP rows 600 mils apart
  • Size 1.3 x 1.4 inches
  • Hole diameter 21 mils
$21.00
28QFN20-D6-SMT-S 28 padQFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 28 Pins
  • 0.5mm (20 mils) Pitch device
  • 5.0mm Package
  • DIP rows are 600 mills apart
$14.00
BB28QFN20-D6-SMT-S 28 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins and 56 additional breadboarding pins.
  • QFN Package type
  • 84 Pins
  • 0.5mm (20 mils) Pitch device
  • 5.0mm Package
  • Inside DIP rows are 600 mills apart
$21.00
28QFN26-D6-SMT-S 28 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 28 Pins
  • 0.65mm Pitch device
  • 7.0mm Package
  • DIP rows are 600 mills apart
$14.00

Part Number   32 Pad    Price Shopping Cart
32QFN20-D6-SMT-S 32 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 32 Pins
  • 0.5mm (20 mils) Pitch device
  • 5.0mm Package
  • DIP rows are 600 mills apart
$16.00
32QFNR20-D6-SMT-S 32 pad QFN MLF Rectangular SMT to DIP breadboard adapter converts rectangular 32 QFN MLF SMT package with 0.5mm, 6 and 10 pins per side to a 600-mil DIP component..
  • QFN Rectangular Package type
  • 32 Pins
  • 0.5 mm Pitch device
  • 5.0 x 7.0 mm Package
  • DIP rows are 600 mills apart
$19.00
32QFN26-D6-SMT-S 32 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 32 Pins
  • 0.65mm Pitch device
  • 7.0mm Package
  • DIP rows are 600 mills apart
$16.00

Part Number   38 Pad    Price Shopping Cart
38QFNR20-D6-SMT-S 38 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 38 Pins
  • 0.5mm (20 mils) Pitch device
  • 5.0 x 7.0mm Package
  • DIP rows are 600 mills apart
$19.00

Part Number   40 Pad    Price Shopping Cart
40QFN16-D6-SMT-S 40 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 40 Pins
  • 0.4mm Pitch device
  • 5.0 x 5.0mm Square Package
  • DIP rows are 600 mills apart
$20.00

Part Number   44 Pad    Price Shopping Cart
44QFN20-D6-SMT-S 44 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 44 Pins
  • 0.5mm (20 mils) Pitch device
  • 7.0mm Package
  • DIP rows are 600 mills apart
$22.00
44QFN26-D6-SMT-S 44 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.65mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 44 Pins
  • 0.65mm Pitch device
  • 8.0mm Package
  • DIP rows are 600 mills apart
$22.00

Part Number   48 Pad    Price Shopping Cart
48QFN16-D6-SMT-S 48 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.4mm to two rows 600-mil apart DIP pins.
  • QFN Package type
  • 48 Pins
  • 0.4mm Pitch device
  • 6.0 x 6.0mm Square Package
  • DIP rows are 600 mills apart
$24.00
48QFN20-D6-SMT-S 48 pad QFN, MLF, QFP, TQFP SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 600-mil apart DIP pins.
  • QFN QFP & TQFP Package types
  • 48 Pins
  • 0.5mm (20 mils) Pitch device
  • 7.0mm Package
  • DIP rows are 600 mills apart
$24.00
48QFN16-PG-SMT-S 48 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.4mm to 0.1 inch pin grid array.
  • QFN Package type
  • 48 Pads
  • 0.4 Pitch device
  • 5.0mm Square Package
  • Pin grid array pins are 0.1 inch apart
$24.00
48QFN20-PG-SMT-S 48 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array.
  • QFN Package type
  • 48 Pads
  • 0.5mm (20 mils) Pitch device
  • 7.0mm Package
  • Pin grid array pins are 0.1 inch apart
$24.00

Part Number   56 Pad    Price Shopping Cart
56QFN16-D9-SMT-S 56 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 900-mil apart DIP pins.
  • QFN Package type
  • 56 Pins
  • 0.4mm Pitch device
  • 7.0mm Package
  • DIP rows are 900 mills apart
$28.00
56QFN16-PG-SMT-S 56 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.4mm to 0.1 inch pin grid array.
  • QFN Package type
  • 56 Pads
  • 0.4mm Pitch device
  • 7.0mm Package
  • Pin grid array pins are 0.1 inch apart
$28.00
56QFN20-D9-SMT-S 56 pad QFN MLF SMT to DIP breadboard adapter converts the SMT package with pitch of 0.5mm to two rows 900-mil apart DIP pins.
  • QFN Package type
  • 56 Pins
  • 0.5mm (20 mils) Pitch device
  • 8.0mm Package
  • DIP rows are 900 mills apart
$28.00
56QFN20-PG-SMT-S 56 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array.
  • QFN Package type
  • 56 Pads
  • 0.5mm (20 mils) Pitch device
  • 8.0mm Package
  • Pin grid array pins are 0.1 inch apart
$28.00

Part Number   64 Pad    Price Shopping Cart
64QFN20-PG-SMT-S 64 pad QFN MLF SMT breadboard adapter converts the SMT package with pitch of 0.5mm to 0.1 inch pin grid array.
  • QFN Package type
  • 64 Pads
  • 0.5mm (20 mils) Pitch device
  • 9.0mm Package
  • Pin grid array pins are 0.1 inch apart
$32.00


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