Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. Adapters for Microchip PIC, Intel, NXP, ST, Freescale, and many more. We also build custom adapters to meet your special needs.

Quarter Size Outline Package - QSOP Surface Mount Component to Breadboard Adapters



These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.



16 Pins 20 Pins 24 Pins
28 Pins 40 Pins 56 Pins


Part Number   16 Pad    Price Shopping Cart
16QSO-D3-SMT-S 16 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25-mils to two 300-mil DIP pin rows.
  • QSOP Package Type
  • 16 Pins
  • 25-mils Pitch device
  • Inside pads span 130-mils
  • Outside pads span 250-mils
  • DIP rows are 300 mills apart
$8.00

Part Number   20 Pad    Price Shopping Cart
20QSO-D3-SMT-S 20 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25-mils to two 300-mil DIP pin rows.
  • QSOP Package Type
  • 20 Pins
  • 25-mils Pitch device
  • Inside pads span 130-mils
  • Outside pads span 250-mils
  • DIP rows are 300 mills apart
$10.00

Part Number   24 Pad    Price Shopping Cart
24QSO-D3-SMT-S 24 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25-mils to two 300-mil DIP pin rows.
  • QSOP Package Type
  • 24 Pins
  • 25-mils Pitch device
  • Inside pads span 130-mils
  • Outside pads span 250-mils
  • DIP rows are 300 mills apart
$12.00

Part Number   28 Pad    Price Shopping Cart
28QSO-D3-SMT-S 28 pad QSOP package to DIP breadboard adapter converts SMT pitch 25-mils pitch to two 300-mil DIP pin rows.
  • QSOP Package Type
  • 28 Pins
  • 25 mils (0.635mm) Pitch device
  • IC body width 155 mils (3.94mm)
  • Inside pads span is 130 mils
  • Outside pads span is 250 mils
  • DIP pins are 18 mil round gold plate
  • DIP rows are 300 mills apart
$14.00

Part Number   48 Pad    Price Shopping Cart
48QSO-D6-SMT-S 48 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 25-mils to two 600-mil DIP pin rows.
  • QSOP Package Type
  • 48 Pins
  • 25-mils Pitch device
  • Inside pads span 300-mils
  • Outside pads span 460-mils
  • DIP rows are 600 mills apart
$14.00

Part Number   56 Pad    Price Shopping Cart
56QSO-D9-SMT-S 56 pad QSOP package to DIP breadboard adapter converts SMT package with pitch of 0.635mm, (25 mils), to DIP pin rows 900 mils apart.
  • QSOP Package Type
  • 56 Pins
  • 0.635mm (25 mils) Pitch device
  • Tip to tip lead minimum is 280 mils
  • Tip to tip maximum is 720
  • DIP rows are 900 mills apart on 100 mil centers.
$28.00


          Specs Discounts Delivery

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