Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, 
SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. Adapters for Microchip PIC, Intel, NXP, ST, Freescale, and many more.  We also build custom adapters to meet your special needs. SOIC Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards and DIP sockets. Pads and pins are wired one to one.

Adapters on these pages are listed in ascending order by the number of pins

6 Pins 8 Pins 14 Pins 16 Pins 18 Pins 20 Pins 22 Pins 24 Pins 28 Pins 32 Pins 36 Pins 40 Pins 44 Pins


Part Number   6 Pad    Price Shopping Cart
6SO-D3-SMT-S 6 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 6 Pins
  • 50 mils Pitch device
  • Pads tip to tip 125 to 373 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$4.00

Part Number   8 Pad    Price Shopping Cart
8SO-D3-SMT-S 8 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 8 Pins
  • 50 mils Pitch device
  • Pads tip to tip 125 to 373 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$4.00

Part Number   14 Pad    Price Shopping Cart
14SOD3-SMT-S 14 pin DIP interposer correction adapter from DIP 0.3" rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 160 x 25 mils
  • DIP through hole pins on 0.10 inch centers. DIP rows are 300 mils apart.
5 each for $10.00
14SO-D6-SMT-S 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 14 Pins
  • 50 mils Pitch device
  • Body width 150 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
5 each for $10.00
14D3-SO15-SMT-S 14 pin DIP interposer correction adapter from DIP 0.3" rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 50 x 25 mils
  • DIP through hole pins on 0.10 inch centers. DIP rows are 300 mils apart.
5 each for $10.00
14D6-SO15-SMT-S 14 pin DIP interposer correction adapter from DIP 0.6" rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 160 x 25 mils
  • DIP through hole pins on 0.10 inch centers. DIP rows are 600 mils apart.
5 each for $10.00

Part Number   16 Pad    Price Shopping Cart
16SO-D3-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$8.00
16SO-D6-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$8.00
16SO15-D3-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • 50 mils Pitch device
  • Pads span 244 mils maximum
  • DIP rows are 300 mils apart
$8.00

Part Number   18 Pad    Price Shopping Cart
18SO-D3-SMT-S 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 18 Pins
  • 50 mils Pitch device
  • Body width 300 mils maximum
  • DIP rows are 300 mils apart
$9.00
18SO-D6-SMT-S 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 18 Pins
  • 50 mils Pitch device
  • DIP rows are 600 mils apart
$9.00

Part Number   20 Pad    Price Shopping Cart
20SO-D3-SMT-S 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 20 Pins
  • 50 mils Pitch device
  • Body width 300 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$10.00
20SO-D6-SMT-S 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 20 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$10.00

Part Number   22 Pad    Price Shopping Cart
22SO-D6-SMT-S 22 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 22 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$11.00

Part Number   24 Pad    Price Shopping Cart
24SO-D3-SMT-S 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • 50 mils Pitch device
  • DIP rows are 300 mils apart
$12.00
24SO-D6-SMT-S 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$12.00
24SO-D6-SMT-S-COH 24 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$12.00
24SO-D6-SMT-S-OH 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$12.00

Part Number   28 Pad    Price Shopping Cart
28SO-D3-SMT-S 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • 50 mils Pitch device
  • Package width up to 300 mils
  • DIP rows are 300 mils apart
$14.00
28SO-D6-SMT-S 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50-mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • 50-mils Pitch device
  • Inside pads span 150 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$14.00
28SO-D6-SMT-S-COH 28 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$14.00
28SO-D6-SMT-S-OH 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$14.00

Part Number   32 Pad    Price Shopping Cart
32SO-D3-SMT-S 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300-mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • 50 mils Pitch device
  • DIP rows are 300 mils apart
$14.00
32SO-D6-SMT-S 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • 50 mils Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$16.00
32SO-D6-SMT-S-COH 32 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00
32SO-D6-SMT-S-LC   32 pad SOIC package to DIP breadboard adapter plus pads and via holes for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • 50 mils Pitch device
  • Body width 300 to 330 mils maximum
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00
32SO-D6-SMT-S-OH 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00

Part Number   36 Pad    Price Shopping Cart
36SO-D6-SMT-S 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • 50 mils Pitch device
  • Body width 330 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$18.00
36SO-D6-SMT-S-OH 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$14.00
36SO-D6-SMT-S-COH 36 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • 50 mils Pitch device
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00

Part Number   40 Pad    Price Shopping Cart
40SO-D6-SMT-S-OH 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 40 Pins
  • 50 mils Pitch device
  • Pads tip to tipp 300 to 700 mils
  • DIP rows are 600 mils apart
$20.00
40SO-D6-SMT-S-COH 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 40 Pins
  • 50 mils Pitch device
  • Pads tip to tipp 300 to 700 mils
  • DIP rows are 600 mils apart
$20.00

Part Number   44 Pad    Price Shopping Cart
44SO-D6-SMT-S 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • 50 mil Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$22.00
44SO-D6-SMT-S-OH 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • 50 mils Pitch device
  • Pads tip to tip 300 to 700 mils
  • DIP rows are 600 mils apart
$22.00
44SO-D6-SMT-S-COH 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600-mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • 50 mils Pitch device
  • Pads tip to tipp 300 to 700 mils
  • DIP rows are 600 mils apart
$22.00


Specs Discounts Delivery

Google
 
Aprilog is a Division of Enable Engineering Co., Inc.