Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. Adapters for Microchip PIC, Intel, NXP, ST, Freescale, and many more. We also build custom adapters to meet your special needs.

SOIC Surface Mount Component to Breadboard Adapters


These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards and DIP sockets. Pads and pins are wired one to one.

Adapters on these pages are listed in ascending order by the number of pins

6 Pins 8 Pins 14 Pins 16 Pins 18 Pins 20 Pins 22 Pins
24 Pins 26 Pins 28 Pins 32 Pins 36 Pins 40 Pins 44 Pins


Part Number   6 Pad    Price Shopping Cart
6SO-D3-SMT-S 6 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 6 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 6 Pins
  • 50 mils Pitch device
  • Pads tip to tip 125 to 373 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$4.00

Part Number   8 Pad    Price Shopping Cart
8SO-D3-SMT-S 8 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 8 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 8 Pins
  • 50 mils Pitch device
  • Pads tip to tip 125 to 373 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$4.00

Part Number   14 Pad    Price Shopping Cart
14SO-D3-SMT-S 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 14 pin DIP interposer correction adapter from DIP 300 mil rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 160 x 25 mils
  • DIP through hole pins on 0.10 inch centers.
  • DIP rows are 300 mils apart.
  • DIP pins are round 18 mil diamater
$5.50
14SO-D3-SMT-P 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 14 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 150 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 300 mils apart
  • DIP pins are 25 mil square wire-wrap
$5.50
14SO-D6-SMT-S 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 14 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 14 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 150 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
  • DIP pins are round 18 mil diameter
$5.50
14D3-SO15-SMT-S 14 pin DIP interposer correction adapter from 300 mil DIP rows to SMT SOIC pads 14 pin DIP interposer correction adapter from 300 mil rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • Component package width 150 mils
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 50 x 25 mils
  • DIP through hole pins on 0.10 inch centers. DIP rows are 300 mils apart.
5.50
14D6-SO15-SMT-S 14 pin DIP interposer correction adapter from 600 mil DIP rows to SMT SOIC pads 14 pin DIP interposer correction adapter from 600 mil DIP rows to SMT SOIC pads
  • Package type 14 SOIC SMT pads on top
  • Component package width 150 mils
  • SMT pitch is 1.27mm (50 mil)
  • SMT pads rows are 150 mils apart
  • Each SMT pad is 160 x 25 mils
  • DIP through hole pins on 0.10 inch centers. DIP rows are 600 mils apart.
$5.50

Part Number   16 Pad    Price Shopping Cart
16SO-D3-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • Pins - 15mil diameter, 130 mils long
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
  • DIP pins are round, 18 mil diameter
$8.00
16SO-D3-SMT-P \ 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins185 mils long
  • Pins - 20mil diameter, 180 mils long
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
  • DIP pins are 25 mil square wire-wrap
$8.00
16SO-D6-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP pins are 18 mil square
  • DIP rows are 600 mils apart
$8.00
16SO15-D3-SMT-S 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 16 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 16 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads span 244 mils maximum
  • DIP rows are 300 mils apart
$8.00

Part Number   18 Pad    Price Shopping Cart
18SO-D3-SMT-S 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 18 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 300 mils maximum
  • DIP rows are 300 mils apart
$8.50
18SO-D6-SMT-S 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 18 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 18 Pins
  • SMT pitch is 1.27mm (50 mil)
  • DIP rows are 600 mils apart
$8.50

Part Number   20 Pad    Price Shopping Cart
20SO-D3-SMT-S 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 20 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 300 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 460 mils
  • DIP rows are 300 mils apart
$10.50
20SO-D6-SMT-S 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 20 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 20 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$10.50

Part Number   22 Pad    Price Shopping Cart
22SO-D6-SMT-S 22 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 22 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 22 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$11.50

Part Number   24 Pad    Price Shopping Cart
24SO-D3-SMT-S 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • SMT pitch is 1.27mm (50 mil)
  • DIP rows are 300 mils apart
$12.20
24SO-D6-SMT-S 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$12.20
24SO-D6-SMT-S-COH 24 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to DIP pin rows. 24 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$12.20
24SO-D6-SMT-S-OH 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to DIP pin rows. 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$12.20
24VS30-40-SMT-S 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 1.0mm (39 mil) to two DIP pin rows. 24 pad SOIC package to DIP breadboard adapter converts SMT package with 1.0mm (39 mil) pitch two 600 mil DIP pin rows.
  • SOIC Package Type
  • 24 Pins
  • SMT pitch is 1.0mm (39 mil)
  • Pins tip to tip maximum (400 mil)
  • DIP rows are 600 mils apart
$12.20

Part Number   26 Pad    Price Shopping Cart
26SO-D6-SMT-S 26 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 24 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 26 Pins
  • SMT pitch is 1.27mm (50 mil)
  • DIP pins are 24 mil round solder-tail
  • DIP rows are 600 mils apart
$13.20
26SO-D6-SMT-S-H 26 pad SOIC package to DIP breadboard adapter. Converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 26 pad SOIC package to DIP breadboard adapter plus < converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 26 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Component pin outside edge from 400 t0 600 mils
  • DIP pins are 24 mil round solder-tail
  • DIP rows are 600 mils apart
$13.20
26SO-D6-SMT-S-COH 26 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 26 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 26 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Component pin outside edge from 400 t0 600 mils
  • DIP pins are 18 mil round solder-tail
  • DIP rows are 600 mils apart
$13.20

Part Number   28 Pad    Price Shopping Cart
28SO-D3-SMT-S 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Package width up to 300 mils
  • DIP rows are 300 mils apart
$14.50
28SO-D6-SMT-S 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 150 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$14.50
28SO-D6-SMT-S-COH 28 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 28 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$14.50
28SO-D6-SMT-S-OH 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 28 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 28 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$14.50

Part Number   32 Pad    Price Shopping Cart
32SO-D3-SMT-S 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows. 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 300 mil DIP pin rows.
  • Compatible SOIC Package Drawing
  • 32 Pins
  • SOIC pitch is 1.27mm (50 mil)
  • IC tip to tip 10.29 - 10.64mm (0.405 - 0.419)
  • Outside pads span 480 mils
  • DIP rows are 600 mils apart
  • DIP pin diameter is 25 mils
$15.50
SMIPL-L32C Aprilog SMPL-L32C, 32 pad SOIC package to DIP breadboard adapter. 32 pad SOIC package to DIP breadboard adapter. Converts SOIC package, 50 mil pitch DIP pin rows.
  • Compatible SOIC Package Drawing
  • 32 Pins
  • SOIC pitch is 1.27mm (50 mil)
  • IC tip to tip 10.29 - 10.64mm (0.405 - 0.419)
  • Outside pads span 510 mils
  • Two Passive component pad sets connected to DIP pins 16 and 32
  • DIP rows are 600 mils apart
  • DIP pin diameter is 17 mils
$15.50
32SO-D6-SMT-S 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • Compatible SOIC Package Drawing
  • 32 Pins
  • SOIC pitch is 1.27mm (50 mil)
  • IC tip to tip 10.29 - 10.64mm (0.405 - 0.419)
  • Outside pads span 480 mils
  • Two Passive component pad sets connected to DIP pins 16 and 32
  • DIP rows are 600 mils apart
  • DIP pin diameter is 25 mils
$15.50
32SO-D6-SMT-S-COH 32 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 32 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$15.50
32SO-D6-SMT-S-LC   32 pad SOIC package to DIP breadboard adapter plus pads and via holes for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 300 to 330 mils maximum
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$15.50
32SO-D6-SMT-S-OH 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 32 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 32 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$15.50

Part Number   36 Pad    Price Shopping Cart
36SO-D6-SMT-S 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Body width 330 mils maximum
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$16.00
36SO-D6-SMT-S-OH SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00
36SO-D6-SMT-S-COH 36 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 36 pad SOIC package to DIP breadboard adapter plus pads for two decoupling capacitors converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 36 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Inside pads span 300 mils
  • Outside pads span 700 mils
  • DIP rows are 600 mils apart
$16.00

Part Number   40 Pad    Price Shopping Cart
SMIPL-U40 36 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 40 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads tip to tip 210 to 490 mils
  • DIP rows are 600 mils apart
$16.50
40SO-D6-SMT-S-OH 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 40 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads tip to tip 300 to 700 mils
  • DIP rows are 600 mils apart
$16.50
40SO-D6-SMT-S-COH 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600 mil DIP pin rows. 40 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 40 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads tip to tip 300 to 700 mils
  • DIP rows are 600 mils apart
$16.50

Part Number   44 Pad    Price Shopping Cart
44SO-D10-SMT-P 44 pad SOIC package to 100 mil breadboard adapter converts SMT package with pitch of 50 mils to four pin rows. 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • SMT pitch is 1.27mm (50 mil)
  • Pads for 200 to 700 mil tip to tip pins
  • Pins are square 25 mil wire wrap on 100 mil centers.
  • 44 Pins in four 11 pin rows.
    • Outside rows are 1 inch apart
    • Inside pin rows are 800 mils apart
$17.00
44SO-D10-SMT-S 44 pad SOIC package to 100 mil breadboard adapter converts SMT package with pitch of 50 mils to four pin rows. 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • SMT pitch is 1.27mm (50 mil)
  • Pads for 200 to 700 mil tip to tip pins
  • Pins are round 18 mil solder tail on 100 mil centers.
  • 44 Pins in four 11 pin rows.
    • Outside rows are 1 inch apart
    • Inside pin rows are 800 mils apart
$17.00
44SO-D6-SMT-S 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • 50 mil Pitch device
  • Inside pads span 140 mils
  • Outside pads span 510 mils
  • DIP rows are 600 mils apart
$17.00
44SO-D6-SMT-S-OH 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows. 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads tip to tip 300 to 700 mils
  • DIP rows are 600 mils apart
$17.00
44SO-D6-SMT-S-COH 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600 mil DIP pin rows. 44 pad SOIC package to DIP breadboard adapter converts SMT package with pitch of 50 mils and pads for two decoupling capacitors to two 600 mil DIP pin rows.
  • SOIC Package Type
  • 44 Pins
  • SMT pitch is 1.27mm (50 mil)
  • Pads tip to tip 300 to 700 mils
  • DIP rows are 600 mils apart
$17.00


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