Aprilog TSOP Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.   



6 Pins 8 Pins 10 Pins 16 Pins 28 Pins 32 Pins 36 Pins 40 Pins 44 Pins 48 Pins 56 Pins 64 Pins 86 Pins


Part Number   6 Pad    Price Shopping Cart
6TS05-D3-SMT-S 6 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 6 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 3.175mm to 5.46mm (0.125 to 0.215 inch)
  • DIP rows are 300 mills apart
$3.00

Part Number   8 Pad    Price Shopping Cart
8TS05-D3-SMT-S 8 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 8 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 5.0mm
  • DIP rows are 300 mills apart
$4.00

Part Number   10 Pad    Price Shopping Cart
10TS05-D3-SMT-S 10 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type
  • 10 Pins
  • 0.50mm (20mil) Pitch
  • Tip-to-tip 2.8mm to 5.3mm (0.110 to 0.220 inch)
  • DIP rows are 300 mills apart
$5.00

Part Number   16 Pad    Price Shopping Cart
16TS05-D3-SMT-S 16 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type
  • 16 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 5.0mm
  • DIP rows are 300 mills apart
$8.00

Part Number   28 Pad    Price Shopping Cart
28TS14-D6-SMT-S   28 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 28 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 14.0mm
  • DIP rows are 600 mills apart
$14.00

Part Number   32 Pad    Price Shopping Cart
32TS2014-D6-SMT-S 32 pad TSOP package to DIP breadboard adapter converts 14.0mm and 20mm SMT package with pitch of 0.55mm (0.0216 inch) to dual inline pin rows. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8 so that the TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 32 Pins
  • 0.55mm (0.0216 inch) Pitch device
  • Tip-to-tip 14.0mm & 20mm
  • DIP rows are 600 mills apart
$16.00

Part Number   36 Pad    Price Shopping Cart
36TST2-D6-SMT-S 36 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 600 mil DIP pin rows.
  • TSOP Package Type 2
  • 36 Pins
  • 8 mm Pitch device
  • DIP rows are 600 mills apart
$18.00


Part Number   40 Pad    Price Shopping Cart
40TS2014-D6-SMT-S 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 600 mil DIP pin rows.
  • TSOP Package Type 1
  • 40 Pins
  • 8mm Pitch device
  • Tip-to-tip 14.0mm & 20mm
  • DIP rows are 600 mills apart
$20.00
40TS20-D6-SMT-S 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of .5mm to two 600 mil DIP pin rows.
  • TSOP Package Type 1
  • 40 Pins
  • 0.5mm (20 mil) Pitch device
  • Tip-to-tip 14mm (550 mils) to 21.6mm (850 mils)
  • DIP rows are 600 mills apart
$20.00

Part Number   44 Pad    Price Shopping Cart
44TST2-40D6-SMT-S 44 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 600 mil DIP pin rows.
  • TSOP Package Type 2
  • 44 Pins
  • 0.8 mm Pitch device
  • DIP rows are 600 mills apart
$22.00

Part Number   48 Pad    Price Shopping Cart
48TS2008-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with 8.0mm or 20.0mm to two 600 mil DIP pin rows.
  • TSOP Package Type
  • 48 Pins
  • 0.5 mm (0.020 inch) Pitch device
  • 8.0mm or 20.0mm Tip to tip.
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$26.00
48TS08-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 600 mil DIP pin rows.
  • TSOP Package Type 1
  • 48 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 8.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$24.00
48TS20-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 600 mil DIP pin rows.
  • TSOP Package Type 1
  • 48 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 20.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$24.00

Part Number   56 Pad    Price Shopping Cart
56TS09-D9-SMT-S 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 5 mm to two 900 mil DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 56 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 9.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14.
  • DIP rows are 900 mills apart
$28.00
56TS20-D9-SMT-S 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 5 mm to two 900 mil DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 56 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 20.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14.
  • DIP rows are 900 mills apart
$28.00

Part Number   64 Pad    Price Shopping Cart
64TST2-D9-SMT-S 64 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 900 mil DIP pin rows.
  • TSOP Package Type 2
  • 64 Pins
  • 0.8 mm Pitch device
  • DIP rows are 900 mills apart
$32.00

Part Number   86 Pad    Price Shopping Cart
86TS10-2x44D6-SMT-S 86 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 8 mm to two 900 mil DIP pin rows.
  • TSOP Package Type 1
  • 86 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 10.0 mm Tip to tip
  • 2 DIP row sets are 900 mils apart
$43.00



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Aprilog is a Division of Enable Engineering Co., Inc.