Aprilog makes & stocks IC adapters for QFP, TQFP, QFN, MLF, SOIC, SSOP, TSSOP, TSOP, VSOP, SOP, PLCC, PGA & SOT packages and stocks test sockets by Enplas, Plastronics, Sensata, Yamaichi & Tokyo Electech. Programming adapters, IC footprint chip changing adapters, and ZIF socket to PCB pads adapters. Adapters for Microchip PIC, Intel, NXP, ST, Freescale, and many more. We also build custom adapters to meet your special needs.

Aprilog TSOP Surface Mount Component to Breadboard Adapters

These adapters consist of a printed circuit board with SMT pads connected to a pins spaced on 0.1 inch centers for mounting on standard prototype breadboards. All pins and pads are wired one to one.   



6 Pins 8 Pins 10 Pins 16 Pins 20 Pins 28 Pins 32 Pins 36 Pins
40 Pins 44 Pins 48 Pins 54 Pins 56 Pins 64 Pins 86 Pins  


Part Number   6 Pad    Price Shopping Cart
6TS05-D3-SMT-S 6 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows. 6 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 6 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 3.175mm to 5.46mm (0.125 to 0.215 inch)
  • DIP rows are 300 mills apart
$3.00

Part Number   8 Pad    Price Shopping Cart
8TS05-D3-SMT-S 8 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 8 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 5.0mm
  • DIP rows are 300 mills apart
$4.00

Part Number   10 Pad    Price Shopping Cart
10TS05-D3-SMT-S 10 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows. 10 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type
  • 10 Pins
  • 0.50mm (20mil) Pitch
  • Tip-to-tip 2.8mm to 5.3mm (0.110 to 0.220 inch)
  • DIP rows are 300 mills apart
$5.00

Part Number   16 Pad    Price Shopping Cart
16TS05-D3-SMT-S 16 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type
  • 16 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 5.0mm
  • DIP rows are 300 mills apart
$8.00

Part Number   20 Pad    Price Shopping Cart
20TS2-D6-SMT-S 20 pad TSOP package to DIP breadboard adapter converts TSOP Type 2 package with pitch of 0.8mm (0.0315 inch) to two 600 mil DIP pin rows.
  • TSOP Type 2 Package Type
  • 20 Pins
  • 0.8mm (0.0315 inch) Pitch device
  • Tip-to-tip 5.0mm max
  • DIP rows are 400 mills apart
$10.00

Part Number   28 Pad    Price Shopping Cart
28TS14-D6-SMT-S   28 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm (0.020 inch) to two 300 mil DIP pin rows.
  • TSOP Package Type 1
  • 28 Pins
  • 0.5mm (0.020 inch) Pitch device
  • Tip-to-tip 14.0mm
  • DIP rows are 600 mills apart
$14.00

Part Number   32 Pad    Price Shopping Cart
32TS2014-D6-SMT-S 32 pad TSOP package to DIP breadboard adapter. 32 pad TSOP package to DIP breadboard adapter converts 14.0mm and 20mm SMT package with pitch of 0.55mm (0.0216 inch) to dual inline pin rows. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8 so that the TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 32 Pins
  • 0.55mm (0.0216 inch) Pitch device
  • Tip-to-tip 14.0mm & 20mm
  • DIP rows are 600 mills apart
$16.00
32TS2014-TS14-SD-V 32 pad TSOP package to DIP breadboard adapter converts 14.0mm and 20mm SMT package with pitch of 0.55mm (0.0216 inch) to dual inline pin rows. 32 pad TSOP package to DIP breadboard adapter converts 14.0mm and 20mm SMT package with pitch of 0.55mm (0.0216 inch) to dual inline pin rows. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8 so that the TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 32 Pins
  • 0.55mm (0.0216 inch) Pitch device
  • Tip-to-tip 14.0mm
  • DIP rows are 600 mills apart
$16.00
32TS2-D6-S 32 pad TSOP type 2 package to DIP breadboard adapter converts SMT package with pitch of 0.8mm (31.5 mil) to dual inline pin rows. Pins are wired 1 to 1 with the TSOP pads. 32 pad TSOP type 2 package to DIP breadboard adapter converts SMT package with pitch of 0.8mm (31.5 mil) to dual inline pin rows. Pins are wired 1 to 1 with the TSOP pads.
  • TSOP Package Type 2
  • 32 Pins
  • 0.8mm pitch device
  • IC leads tip-to-tip from 8 to 12mm (330-480 mils)
  • DIP rows are 600 mills apart
$16.00
32TS20-D6-S 32 pad TSOP Type 1 package to DIP breadboard adapter converts 20mm SMT package with pitch of 0.5mm (20 mil) to dual inline pin rows. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8 so that the TSOP Type 1 package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package. 32 pad TSOP package to DIP breadboard adapter converts 20mm SMT package with pitch of 0.5mm (20 mil) to dual inline pin rows. DIP pin 1 is connected to TSOP pin 9 and DIP pin 32 is connected to TSOP pin 8 so that the TSOP package on this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 32 Pins
  • 20.0 mm Tip to tip
  • 0.5mm Pitch device
  • Tip-to-tip 20.0mm
  • DIP rows are 600 mills apart
$16.00

Part Number   36 Pad    Price Shopping Cart
36TST2-D6-SMT-S 36 pad TSOP package type 2 to DIP breadboard adapter. 36 pad TSOP package type 2 to DIP breadboard adapter converts SMT package with pitch of 0.8mm to two 600 mil DIP pin rows.
  • TSOP Package Type 2
  • 36 Pins
  • O.8mm Pitch device
  • DIP rows are 600 mills apart
$18.00


Part Number   40 Pad    Price Shopping Cart
40TS2014-D6-SMT-S 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows.
  • TSOP Package Type 1
  • 40 Pins
  • 0.8mm Pitch device
  • Tip-to-tip 14.0mm & 20mm
  • DIP rows are 600 mills apart
$20.00
40TS2014-D6-CL-S 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to two DIP pin rows.
  • TSOP Package Type 1
  • 40 Pins
  • 0.8mm Pitch device
  • Tip-to-tip 14.0mm
  • DIP rows are 600 mills apart
$20.00
40TS20-D6-SMT-S 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of .5mm to two DIP pin rows. 40 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of .5mm to two DIP pin rows.
  • TSOP Package Type 1
  • 40 Pins
  • 0.5mm (20 mil) Pitch device
  • Tip-to-tip 14mm (550 mils) to 21.6mm (850 mils)
  • DIP rows are 600 mills apart
$20.00

Part Number   44 Pad    Price Shopping Cart
44TST2-D6-SMT-S 44 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of .8mm to two DIP pin rows. 44 pad TSOP type 2 package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. All pins are connected 1 to 1 TSOP to DIP.
  • TSOP Package Type 2
  • 44 Pad TSOP to 44 pin DIP
  • 8.9 - 12.0mm tip to tip
  • 0.8mm Pitch device
  • DIP rows are 600 mills apart
$22.00
44TST2-40D6-SMT-S 44 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of .8mm to two DIP pin rows. 44 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. TSOP pads 10, 11, 32, and 33 not connected. All other pins are connected 1 to 1 TSOP to DIP.
  • TSOP Package Type 2
  • 44 Pad TSOP to 44 pin DIP
  • 8.9 - 12.0mm tip to tip
  • 0.8mm Pitch device
  • DIP rows are 600 mills apart
$22.00

Part Number   48 Pad    Price Shopping Cart
48TS2008-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with 8.0mm or 20.0mm to DIP pin rows. 48 pad TSOP package to DIP breadboard adapter converts SMT package with 8.0mm or 20.0mm to DIP pin rows.
  • TSOP Package Type
  • 48 Pins
  • 0.5 mm (0.020 inch) Pitch device
  • 8.0mm or 20.0mm Tip to tip.
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$26.00
48TS08-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows.
  • TSOP Package Type 1
  • 48 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 8.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$24.00
48TS20-D6-SMT-S 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm to DIP pin rows. 48 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm to DIP pin rows.
  • TSOP Package Type 1
  • 48 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 20.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 13 and DIP pin 48 is connected to TSOP pin 12.
  • DIP rows are 600 mills apart
$24.00
48TS20-32D6-SMT-S-M27C320-OKI 48 pad Okidata M27C320 TSOP to 32 pin DIP breadboard adapter. 48 pad Okidata M27C320 TSOP to 32 pin DIP breadboard adapter converts SMT package with pitch of 0.5mm to DIP pin rows.
  • TSOP Package Type 1
  • 48 Pad to 32 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 18.3 - 18.5 mm (720 -728 mil) Tip to tip
  • DIP rows are 600 mills apart
$24.00

Part Number   54 Pad    Price Shopping Cart
54TS2-D9-SMT-S 54 pad TSOP type 2 package to DIP breadboard adapter. Converts SMT package with pitch of 0.8mm to DIP pin rows. 54 pad TSOP type 2 package to DIP breadboard adapter. Converts SMT package with pitch of 0.8mm to DIP pin rows.
  • TSOP Package Type 2
  • 54 Pins
  • 0.8mm (0.032 inch) Pitch device
  • 14.5mm maximim IC leads Tip to tip
  • Pin DIP pins and IC pads are wired 1 to 1
  • DIP rows are 900 mills apart on 100 mil centers
$28.00

Part Number   56 Pad    Price Shopping Cart
56TS09-D9-SMT-S 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.5mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package. 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 5 mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 56 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 9.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14.
  • DIP rows are 900 mills apart
$28.00
56TS20-D9-SMT-S 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 5 mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package. 56 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 5 mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14 so that this adapter can be plugged directly into a DIP socket for the same chip in a DIP package.
  • TSOP Package Type 1
  • 56 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 20.0 mm Tip to tip
  • Pin 1 is connected to TSOP pin 15 and DIP pin 56 is connected to TSOP pin 14.
  • DIP rows are 900 mills apart
$28.00
56TS2-D9-SMT-S 56 pad TSOP type 2 package to DIP breadboard adapter converts SMT package with pitch of 8 mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 1. 56 pad TSOP type 2 package to DIP breadboard adapter converts SMT package with pitch of 8 mm to DIP pin rows. DIP pin 1 is connected to TSOP pin 1.
  • TSOP Package Type 2
  • 56 Pins
  • 0.8mm Pitch device
  • IC pads from 170 to 690 mils Tip to tip
  • Pin 1 is connected to TSOP pin 1.
  • DIP rows are 900 mills apart
$28.00

Part Number   64 Pad    Price Shopping Cart
64TST2-D9-SMT-S 64 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. 64 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows.
  • TSOP Package Type 2
  • 64 Pins
  • 0.8mm Pitch device
  • DIP rows are 900 mills apart
$32.00

Part Number   86 Pad    Price Shopping Cart
86TS10-2x44D6-SMT-S 86 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows. 86 pad TSOP package to DIP breadboard adapter converts SMT package with pitch of 0.8mm to DIP pin rows.
  • TSOP Package Type 1
  • 86 Pins
  • 0.5mm (0.020 inch) Pitch device
  • 10.0 mm Tip to tip
  • 2 DIP row sets are 900 mils apart
$43.00


     



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Aprilog is a Division of Enable Engineering Co., Inc.
Aprilog is a Division of Enable Engineering Co., Inc.